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5G Module Thermal Management- 6.0W/mK Thermal Pad Is Being Used

2021-3-19 17:38:15   |   Source:GLPOLY   |   Author:GLPOLY   |   Views:

GLPOLY is always at the leading edge of development of thermal interface materials, providing advanced technological thermal interface materials, also GLPOLY is one of few suppliers that can provide high thermal conductivity and high performance thermal management materials.

Maybe many suppliers claimed that they could provide high perofmrance thermal gap pad for example, 6.0W/mK thermal pad. Often, if you test it, you would find there was big difference between test result and specification. Why did it happen? Because lots of customers could not test thermal gap pad themselves, what they could do was testing the assembled product. so the thermal gap pad was qualified or not, they could not judge before testing. GLPOLY will never do this. All indexes on specification are consistent with results.

Tekmodul A 5G telecom module manufacturer from Germany contacted me and enquired about thermal gap pad with thermal conductivity of 6.0W/mK. He said he had tested samples provided by three suppliers already, no one could meet his requirement though they said and marked it’s 6.0W/mK on specification. This time he collected samples from three suppliers again including GLPOLY XK-P60 thermal gap pad, if he could not find a proper one, he would use Laird Tflex HD80000, even this product was expensive.

When customer finished the aging test, he found GLPOLY XK-P60 was the most reliable one, during the entire test, XK-P60’s index change was the smallest, performing reliably and stably. The results showd that the thermal conductivity of XK-P60 thermal gap pad was 6.05W/mK after aging test. GLPOLY XK-P60 emerged as the best one, eliminating the possibility of buying Laird Tflex HD80000. Now XK-P60 has been applying to customer’s 5G modules.

GLPOLY has been supplying dJI, GAC NE, Freetech Pilot, NIO Motor, Lixiang Motor etc with thermal gap pad, thermal gel, thermal gap filler, thermally conductive structural adhesive and more, helping them design devices that run cooler and more reliably, perform at their best.

 
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