Phase change material is a ecellence thermal management solution for 5G telecom infrastructure components such as remote radio units, active antenna units, base processing units, optical transceivers, routers and servers.
The PCMs are in sheet, even they are reinforced by foil or not. It is common knowledge that solid thermal interface materials provide high hardness and low compression, they are not suitable for filling intricate gaps and voids. GLPOLY developed a printable PCM to improve interface contact.
One customer wanted to apply PCM to PCB, consulting with us about this, especially printable PCM. We didn’t have such a phase change material then, and as we knew, only Honeywell could provide printable phase change material—PCM45M-SP. The customer couldn’t find such a phase change material in local market, and had to test with phase change material in sheet form.
This phase change material was applied to a fragile PCB, high compressive forces is forbiden to be applied to PCB thus decreasing component failure. In this case, the phase change material can’t contact with the PCB and heatsink completely, even the sheet form liquified when temperature is above phase change temperature, resulting in high temperature rise.
After learning about customer’s application, we promised that we finish printable PCM in seven days. One week later, we delivered samples to customer. “No matter the dipensing efficiency or thermal performance, we were satisfied with the results.” Customer fed back when test was finished.
Taking Honeywell PCM45M-SP as benchmark, GLPOLY developed XK-C35D printable phase change material which is with a pahse change temperature of 45℃. It will wet out interface and decrease thermal resistance, improving heat transfer.
GLPOLY phase change materials have been applied to 5G telecom modules, consumer electronics, automotive electronics and LED lighting.
GLPOLY focuses on solving thermal management challenges for top class clients such as LG, DJI, DT Mobile, Han’s Laser, GAC NE Motor, NIO Motor and more, providing advanced thermal interface materials for them to help them desgin devices that run more reliably.
