In this day and age, a electronic device must run at a high speed while operating smoothly and efficiently.To achieve this goal, engineers are working towards enhancing the computing power of electronics in smaller package,thus generating an unavoidable byproduct---heat, especially in 5G applications, components will generate a great deal of heat due to a huge amount of data exchange in operation.  

With the advancement of 5G technologies and growth of 5G infrastructure deployment, developing effective thermal management solution becomes imperative. And thermal interface materials are the core for thermal management in electronics devices.

In order to overcome thermal management challenges of 5G devices, GLPOLY develops a performance thermal gel with a thermal conductivity of 6.0W/mK. this material is designed for high-power 5G components such as optical transceiver, routers, servers and more. GLPOLY thermal gel XK-G60 is a dispensable gap filling, non-curing material, it wets out interface decreasing contact thermal resistance, improving heat transfer. This material deflects under low compressive forces, accommodeting a variety of bondline thickness for applications.

GLPOLY XK-G60 thermal gel has been applying to 5G telecommunications, automotive electronics, drones, consumer electronics. For instance, XK-G60 has been applying in 5G modules of DT Mobile for three years.

XK-G60 thermal gel brings you following advantages and benefits:

1. High Performance, thermal conductivity 6.0W/mK;

1. Non-curing, low contact thermal resistance;

3. Supply in cartridge, providing purchasing and logistics flexibility;

4. Compatible with hugh volume, automated dispense processes, improving production efficiency and reducing cost;

GLPOLY is one of the most prominent thermal interface materials manufacturers in China with sophisticated R&D team, providing you with pioneering thermal management and advanced thermal interface materials, keeping your electronics devices performing at their best.