With the advancement of 5G technology, more and more 5G base station are deployed in any area worldwide, the modules such as radio units, baseband units, servers and routers etc requires effective thermal management solution, using exceptional performance thermal interface materials.

A lot of engineers are struggling with selection of suitable thermal interface material:  how to select? Which brand is better? To many people, THERM-A-GAP GEL series of thermal gel is preferred because of its brand reputation. Do we have any other choices? Of course we have.

GLPOLY forecasted the trend of 5G development and formulated business expansion strategy in 2016, investing lots of sources to develop high performance thermal interface materials including high thermal conductivity thermal gap pad, thermal gel, printable PCM and thermally conductive structural adhesive etc.

These thermal interface materials have a range of thermal conductivity from 6.0W/mK to 13.0W/mK. For instance, GLPOLY has launched a high performance thermal gel XK-G70 with 7.0W/mK thermal conductivity in 2019. It is a liquid gap filling material designed for transceivers and routers, and is compatible with automated dispense processes. This non-curing material wets-out interface, decreasing contact thermal resistance, optimizing heat conduction.

GLPOLY has partnered with DT Mobile, ZTE, TINNO Mobile and tekmodul, providing high performance thermal interface materials and design flexibility.