Efficient thermal management is crucial to maintaining the reliability and extending the life cycle of electronic devices and equipments.

As technology advances, next-generation electronic devices require higher power in more compact package, the challenges associated with thermal management become more intense.

Thermal interface materials are required:

Higher thermal conductivity;

Low thermal impedance;

Compliance and conformability;

High stability and reliability;

Greater adhesion;

Ease of handling and use;

Longer service life;

GLPOLY has been specialized in development and manufacturing of thermal interface materials for more than ten years, focusing on sectors of 5G telecom, new energy electric vehicle, automotive electronics, collaborating with leading enterprises such as DT Mobile, tekmodul, TINNO Mobile, GAC Motor, NIO Motor and more. GLPOLY provides clients with complete portfolio of thermal interface materials inlcuding thermal gap pad, thermal gap filler, thermal gel, thermally conductive structural adhesive etc and professional knowledge to solve the thermal management challenges, protecting their brand reputation for performance and reliability.