GLPOLY thermal gap pad was applied to 5G telecom modules, solving the thermal management challenges, overtaking world-class brands.

Earlier 2020,  a customer from Germany, contacted me and consulted me about thermal gap pad with 5.5W/mK thermal conductivity or above for 5G router. Through communication, I knew that he had tested several products from different suppliers, but no one met his design requirements.

High conformability, compression rate and low thermal impedance were required.  After further discussing, I recommended XK-P60 5G device thermal management thermal gap pad, and showed him in-house test report we made for other customers. He was satisfied with the performances, but he wanted to verify performance and reliability of thermal gap pad in package.

I was confident that XK-P60 thermal gap pad suited customer’s demand, and wished to provide samples. Customer received samples in 7 days, he said this was the fastest response he had met, he was really impressed.

Three months later, I received this customer’s email, he told me that performance and reliability of XK-P60 thermal gap pad were excellent, superceding other competitive products. Now XK-P60 has been applying to this 5G router project in volume production.

GLPOLY thermal gap pad XK-P60 is a high performance, electrical isolating gap filling material with 6.0W/mK thermal conductivity. It is highly conformable to component topography, improving thermal contact. Automated production lines eliminate human error and keep the consistency of products.

GLPOLY has collaborated leading enterprises like dJI, GAC New Energy, NIO Motor, DT Mobile, TINNO Mobile, telmodul, providing them with performance thermal interface materials, technological solutions and superior service.