Faster electronic devices bring the world at users’ fingertips. In today’s world, a device must work at a high speed whiling delivering smooth and efficient performance. Overheating is one of the critical concerns for high-powered devices, especially for AI devices. GLPOLY launched a thermal gel with 4.0W/mK thermal conductivity for high powered electronic application, solving thermal management challenge.
Early this year, a logistics vehicle manufacturer contacted us, inquiring about thermal gel that would be used in AGV (automated guided vehicle). In the past two years, he used a imported thermal ge---THERM-A-GAP GEL37. But customer would like to find a local brand of product to replace imported one due to logistics complexity caused by pandemics. GLPOLY thermal gel XK-G40 offers equivalent performance to THERM-A-GAP GEL37, and has been used in DJI drones for years. We were confident that GLPOLY XK-G40 thermal gel could absolutely repalce GEL37.
Customer collected samples from five local suppliers including GLPOOLY thermal gel XK-G40, carrying out extreme temperature cycling and shock. Two months later, I received customer’s email in which customer approved the performance of XK-G40. The index change before and after ageing test was less than 5%, emerging as the best and most reliable one. Furthermore, we promised customer a 7-day lead time and term of DAP, decreasing the logistics and storage complexity. Last week, I was told that the trial production was finished and went well, the preparations for mass production are rolling ahead.
GLPOLY thermal gel XK-G40 is a high performance, non-curing, gap filling materials, and is suitable for a variety of gap thickness. It deforms in low compression force, decreasing stress on component, thus decreasing component failures. Raw material
GLPOLY thermal interface materials have been approved by many leading enterprises such as Quectel Wireless, DT Mobile, LG, DJI, GAC Motor, NIO Motor etc, used in 5G telecom, new energy electric vehicles, auto pilot and more.
GLPOLY is ready to help you solve thermal management challenges with time-tested knowledge and complete portfolio of advanced thermal interface materials. Why not have a try?