THERMAL GEL,THERMAL GAP FILLER,THERMAL MANAGEMENT,SILICONE FREE THERMAL GEL,NON SILICONE
To solve the thermal management demands of today’s electronic devices,GLPOLY has developed a complete portfolio of high performance products. Effectively control of heat is an increasing concern among today’s electronic device designer and manufacturer, as each new electronic product generation requires higher power in smaller packages. The challenges associated with thermal management become more intense.
GLPOLY developed special thermal interface materials for individual device, such as silicone free thermal gel XK-GN30, this product is designed for applications which requires no siloxane volatiles, no silicone oil leakage. For example, one of our customer request a thermal interface material for security camera. The thickness of material should be 0.1mm and thermal conductivity could be 2W/mK or 3.0W/mK, then the customer request some thermal gap pads and thermally conductive insulators samples.
Actually for such a thin interface, we don’t recommend a thermal gap pad because these thermal pads are used for large tolerance. Liquid materials would be a good choice. Firstly, liquid materials provide ultra thin interface thickness, secondly, liquid thermal materials has lower thermal resistance than thermal pads. Furthermore, the this is optical lens in application. if we use traditional thermal silicone grease or silicone gel, there will be siloxane volatiles attaching on the optical lens, making the lens atomized and affecting definition of images.
Based on the above mentioned factors, we recommended silicone free thermal gel XK-GN30. It is a high performance, low thermal resistance thermal gel, designed for automated dispensing system and to eliminate time consuming hand assembly. GLPOLY XK-GN30 has been successfully used to fill a variety of different gap thickness. The soft gel is ideal for fragile components with ultra low compression force and requires no mixing or curing, providing superior design flexibility.
GLPOLY is at the leading edge of thermal interface materials development, providng a variety of thermal management solutions to help keep your devices stable