In this day and age, electronics are desgined towards high performance, small package, thus generating a large amount of heat. For dealing with this challenge, engineers are developing effective thermal management solution while thermal interface materials manufacturers are researching new performance materials. Though there are a lot of thermal interface materials on the market, it’s still hard to find a proper, high performance thermal interface material for 5G devices.
For solving thermal management challenge of 5G telecom equipment, GLPOLY launched a thermal gel with a thermal conductivity of 7.0W/mK. This material is one of the best solutions for 5G device thermal management.
DT Mobile is a leading 5G telecommunication equipment manufacturer in China. In 2018, an engineer from DT Mobile consulted me about performance thermal interface material for server thermal management, requesting high thermal conductivity, ease of use. GLPOLY has several performance thermal interface materials for 5G such as thermal gap pad(8.0-11.0W/mK), thermal gap filler pad(6.0-8.0W/mK) and thermal gel(6.0-8.0W/mK). According to customer’s design, the gap was just 0.12mm, for we recommended XK-G70 thermal gel for maximizing thermal performance. thermal gel has better performance than thermal gap pad and thermal gap filler due to low thermal resistance and ultra thin bond line thickness. More importantly, XK-G70 thermal gel is non-curing, and wetting-out interface to decrease contact thermal resistance.
Customer had carried out aging test for one month, the temperature rise was even lower than they expected in the entire process. We have been cooperating for three years till now.
GLPOLY thermal interface materials has been applied to 5G telecom devices such as optical transceiver, router and server, EV battery pack, automotive electroncis, pilot system including mm-wave radar, camera etc. GLPOLY has partnered with leading enterprises such as DT Mobile, Huawei, LG, UFI Filter, GAC Motor, NIO Motor and more, protecting their brand reputation for performance and reliability with full portfolio of advanced thermal interface materials.
