No matter your appllication, GLPOLY is ready to help you solve your toughest thermal management challenges with complete portforlio of thermal interface materials and time-tested knowledge.
Are you using silicone based thermal interface materials in your devices? And worried about siloxane? GLPOLY provides non-silicone thermal interface materials, eliminating your conerns about siloxane.
GLPOLY has full portfolio non-silicone thermal interface materials including non-silicone thermal gap pad, non-silicone thermal gel, non-silicone thermal grease and nonsilicone thermally conductive structural adhesive.
Here we introduce you a non-silicone thermal gel XK-GN30.
GLPOLY XK-GN30 is a one component, high performance, non-curing, dispensable gap filling material with a 3.0W/mK thermal conductivity. This material provides low thermal impedance designed to solve thermal management challenges of electronic devices. It’s supplied in syringe or cartridge and compatible with high volume, automated dispense processes, eliminating time consuming hand assembly, decreasing installation cost, reducing customer purchasing, logstics and assembling complexity.
Non-silicone thermal gel XK-GN30 is ideal for low stress applications. It deforms under low compressive forces, filling intricate air gaps, decreasing stress on component thus decreasing component failures. This material accommodates a variety of bondline thickness for applications to multiple devices, filling various gap thickness.
GLPOLY non-silicone thermal gel is easily dispensable, no pump out, easy to wipe and re-work, no contamination to components. Characteristic of natural tack will reduce contact thermal resistance, improving heat transfer.
GLPOLY non-silicone thermal gel XK-GN30 has been applied to LED lighting, displayer, laser, smartphone, 5G telecommunication and automotive electronics, keeping your devices performing at their best.
GLPOLY has collaborated with DT Mobile, tekmodul, DJI, LG, GAC Motor, NIO Motor and more, providing them with advanced thermal interface materials and pioneering thermal management solution to help them design devices that run cooler and reliably.
