GLPOLY thermal gel is a non-curing, low oil bleeding gap filling material designed to solve thermal management challenges of high-powered electronic devices, surmounting BLT and tolerance issues.
Overheating is a critical concern for next-generation electronics and devices, and is one of the fundamental causes of electronic failures. For dealing with this issue, engineers are developing thermal management solutions and thermal interface materials. GLPOLY has developed high performance thermal gel for electronic devices competing against imported products, for instance 5.0W/mK and 7.0W/mK thermal gel in 2019, providing exceptional performance, design flexibility and ease of use.
We had a case last year. The customer designed a thermal management solution for logistics vehicles which would shuttle between floors distributing ordered items. A effective thermal management solution was required to keep vehicles running all the day smoothly. For the irregular plane of interface, we suggest customer use liquid gap filling material. It conforms under low compressive force, covering interface with good flowability. He used to use thermal gap pads in different size and thickness on the PCB, we knew that it’s hard to assemble thermal gap pad by an automated assembly processes. Thermal gel would reverse this situation, it was compatible with automated dispense processes, eliminating time consuming hand assembly. Customer carried out accelerated aging test on 5.0W/mK thermal gel to verify performances at 70, 120 and 180 Celsius degree. When customer reviewed the test report, he was surprised. It was 10 Celsius degree lower than he tested with thermal gap pad, keeping devices running well. More importantly, it redeced installation cost and purchasing complexity.
GLPOLY thermal gel has been applied to 5G telecom, smartphone, drones, automotive electronics in volume production for three years. GLPOLY has partnered with DT Mobile, DJI, LG, Huawei, GAC Motor, NIO Motor and more, protecting their brand reputation for performance and reliability with precise thermal management solution and advanced thermal interface materials.
