Modified epoxy thermally conductive structual adhesives are designed for EV battery cell bond, improving thermal management and rigidity of battery pack...

With the advent of CTP technology of battery pack, the demand for a new material..

6.0W/mK thermal gap pad is ideal for improving heat dissipation in 5G modules such as routers, optical transceivers, antenna unit, remote radio units and more...

non-silicone thermal gel is designed for precise, silicone-sensitive electronics, such as automotive electronics, cameras, and optical embedded devices...

non-silicone thermal gel designed for precision devices, no oil bleeding, no dripping, eliminating siloxane concerns...